Basic process of making a circuit board:
1. Prepare materials: Choose a suitable copper-clad board, which usually comes in two types: resin and fiberglass. Although fiberglass copper-clad boards are difficult to cut, they are not easy to deform.
2. Design a circuit diagram: Use drawing software to design a circuit diagram and print it on transfer paper.
3. Print the circuit board: Print the designed circuit diagram on transfer paper and paste it on the copper-clad board.
4. Etch the circuit board: Use an etching liquid (such as concentrated hydrochloric acid, concentrated hydrogen peroxide and water mixture) to etch away the uncovered copper film to form a circuit pattern.
5. Drill holes: Drill holes according to the position of the components on the circuit board so that the components can be inserted.
6. Surface treatment: Clean the circuit board and perform necessary surface treatment, such as coating a solder mask.
Detailed description of each step
1. Prepare materials:
Choose a suitable copper-clad board, which can be a resin or fiberglass type.
Make sure the size and shape of the copper-clad board meet the design requirements.
2. Design the circuit diagram:
Use drawing software (such as AutoCAD, Altium Designer) to design the circuit diagram.
Ensure the precision and accuracy of the circuit diagram to avoid errors in subsequent production.
3. Print the circuit board:
Print the designed circuit diagram on transfer paper, and pay attention to choosing the appropriate print quality and paper type.
Paste the printed circuit diagram on the copper clad board to ensure accurate alignment.
4. Etch the circuit board:
Use the etching liquid (a mixture of concentrated hydrochloric acid, concentrated hydrogen peroxide and water) to soak the copper clad board and etch away the uncovered copper film.
Check the etching effect to ensure that the circuit pattern is clear and correct.
5. Drilling:
According to the position of the components on the circuit diagram, use a drill to select a suitable drill needle for drilling.
Ensure that the accuracy and depth of the drilling meet the requirements so that the components can be inserted firmly.
6. Surface treatment:
Clean the circuit board to remove residual etching liquid and impurities.
Apply a solder mask to protect the circuit part from external influences.
Make necessary markings and process the mounting holes to facilitate subsequent component installation and welding.
