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What is the pcba production process?

author:admintime:2024-10-16 16:58:32 Second Browse

informative abstract:

SMT mount processing : First, the solder paste is printed on the PCB, accurately positioned by SPI, and then mounted. After reflow soldering to ensure that the components are firmly fixed, AOI will check the quality and repair if necessary.

The PCBA production process mainly includes the following key steps : 

    SMT mount processing : First, the solder paste is printed on the PCB, accurately positioned by SPI ( Selective Paste Imaging ), and then mounted. After reflow soldering to ensure that the components are firmly fixed, AOI ( Automatic Optical Inspection ) will check the quality and repair if necessary. 

    DIP plug-in and assembly : After the PCB empty board is loaded through SMT, it enters the DIP plug-in link, and the components are inserted into the reserved hole position, and then welded through the tin furnace. 

    Comprehensive processing flow : The production of PCBA also includes components procurement and inspection, SMT placement, plug-in processing, program burning, testing and aging. The quality control of each link is crucial to ensure the performance and reliability of the final product.

The detailed steps are as follows : 

   1.Empty board loading : The PCB empty board is arranged neatly on the shelf and sent to the printing machine of the SMT production line through the automatic board machine. 

   2.Printing solder paste : The solder paste is printed on the pad of the PCB to be welded, and the solder paste is melted by high temperature reflow soldering, and the electronic components are soldered on the circuit board. 

   3.Solder paste inspection : through the optical instrument to check the quality of solder paste printing, to ensure that there is no more tin, less tin and other issues, if necessary, repair. 

   4.High-speed placement and universal placement : high-speed placement machine mounts small volume components, while universal placement machine mounts large volume components to ensure accurate alignment. 

   5.Reflow soldering : The solder paste is melted by reflow soldering, the components are fixed on the circuit board, and the temperature curve affects the welding quality.

   6.Optical inspection : The welding quality of the components is checked by AOI to ensure that there are no defects. 

   7.Wave soldering : Wave soldering is performed on specific components to ensure reliable connection.

   8.Functional test and electrical performance test : Functional test and electrical performance test are carried out on the welded PCBA to ensure the normal operation of each function. 

   9.Finished assembly and packaging : The tested PCBA will be assembled into a finished circuit board, and anti-static and shock-proof packaging.

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