smt pcba

   SMT patch technology is a technology that directly mounts pinless or short-lead surface mounted components (referred to as SMC/SMD)on the surface of a printed circuit board(PCB)or other substrate surface. This technology uses methods such as reflow soldering or dip soldering to solder and assemble components to the PCB board to form a complete circuit connection.

SMT patch technology process:

  1.Material preparation: Prepare raw materials such as PCB boards,electronic components, and solder paste.

  2.Silk screen printing: Use a silk screen printer to print solder paste on the pads of the PCB board to prepare for the soldering of components.

  3.Mounting:Use a patch machine to accurately mount components on the pads of the PCB board.

  4.Curing: Heat the solder paste to the melting point through equipment such as a hot air furnace to form a firm solder connection between the components and the PCB board.

  5.Inspection: Use equipment such as AOI (automatic optical inspection)to perform quality inspection on the soldered PCB board to ensure that the welding quality meets the standards.