Circuit board cutting refers to the process of cutting the original copper-clad laminate (CCL) into boards suitable for production line processing according to specific design specifications. This process not only involves physical cutting operations, but also covers a series of technical conversions and optimizations from customer design to production preparation. The success of cutting directly affects the smooth progress of subsequent PCB processing and the quality of the final product.
The purpose and importance of cutting:
The main purpose of cutting is to cut, bake, plan and grind the boards required for production according to the engineering design, and process them into specific sizes for subsequent production. Through cutting, the original copper-clad laminate can be cut into boards suitable for production line processing to ensure the smooth progress of subsequent processing.
The process flow of cutting usually includes the following steps:
1. Sample arrangement: Sample arrangement is performed on the inspected board to determine the cutting path and size.
2. Pressure analysis: Pressure analysis is performed on the board to ensure stability during the cutting process.
3. Graphic conversion: Convert the design drawing into a cuttable graphic.
