The calculation method of copper plating thickness of circuit board mainly involves current density, plating time, plating efficiency and some specific coefficients.
Specifically, the thickness of the copper plating layer of the circuit board can be calculated by the following formula :
Coating thickness(um)=current density (ASF)×plating time(min)×plating efficiency×specific coefficient coating thickness (um)=current density(ASF)\times plating time(min)\times plating efficiency\times specific coefficient coating thickness(um)=current density(ASF)×plating time(min)×plating efficiency×specific coefficient
Among them, the specific coefficient can be 0.0202 or 0.023, depending on the calculation method and correction factor used. This coefficient takes into account factors such as electricity, equivalent, molar mass, and density. The molar mass of copper is 63.5.One mole of copper ion requires two moles of electrons to become elemental copper, and the charge of one mole of electrons is equal to 96485 Coulomb (Faraday constant). The density of copper is usually 8.9.
In the calculation process, it is also necessary to consider the current efficiency, that is, the efficiency of copper deposition in the actual electroplating process, which is usually less than 1. The consideration of current efficiency makes the calculation results closer to the actual electroplating effect. In addition, it is also necessary to note that there may be additional copper deposition on the hanger or shielding, so appropriate corrections may be required in practical applications.
In summary, the calculation of the thickness of the copper plating layer on the circuit board is a process that comprehensively considers multiple factors, including current density, plating time, plating efficiency, and specific calculation coefficients. Through reasonable parameter setting and calculation, more accurate copper coating thickness can be obtained, so as to ensure that the quality and performance of the circuit board meet the requirements.
