The bonding reinforcement needs to be attached to the flexible circuit board first, and then the reinforcement is positioned by hot pressing. The hot pressing reinforcement is that at a certain temperature, the thermal hardening adhesive of the reinforcing film begins to melt to make the reinforcing film adhere to the product, so that the reinforcement is positioned. Pressure-sensitive reinforcement can be adhered to the product without heating.
Pressing reinforcement needs to be pressed on the flexible circuit board at high temperature. The hot-pressing reinforcement uses high temperature to melt the hot-hardening adhesive of the reinforcing film, and uses appropriate pressure or vacuum to make the reinforcing film closely attached to the flexible circuit board. The pressure-sensitive reinforcement does not need heating, and the flexible circuit board can be pressed by a cold press. For hot pressing reinforcement, the pressure is small during pressing, the time is short, and the reinforced thermal hardening adhesive is not completely aged. It needs to be baked at high temperature for a long time to make the adhesive completely aged and increase the adhesion between the reinforcement and the flexible circuit board.
